基于模态分析的倒装焊焊点开裂缺陷检测方法研究
刘俊超
（西南电子技术研究所，四川 成都 610036）
摘要：随着倒装焊焊点向高密度和超细间距方向发展，在倒装焊焊接界面更易出现变形、翘曲或划伤，进而引起焊点疲劳和应力集中，导致焊点缺陷的产生，阻碍了倒装焊技术的发展。提出了一种基于模态分析的焊点缺陷检测方法，通过仿真分析和实验研究对倒装焊焊点开裂缺陷进行了研究，仿真和实验结果均表明焊点开裂会引起样片模态振型的变化和共振频率的下降，证明了倒装焊焊点开裂缺陷可以通过样片的模态特征如模态振型、共振频率等来进行识别，为焊点的缺陷检测提供了一种新思路和新方法。
关键词：倒装焊；模态分析；缺陷检测
中图分类号：TJ765.4 文献标志码：A doi：10.3969/j.issn.1006-0316.2016.08.004
文章编号：1006－0316 (2016) 08－0017－06
Defect Inspection Method Reasearch for Flip Chip Open Solder Joints based on Modal Analysis
LIU Junchao
( Southwest Electronic Technology Institute, Chengdu 610036, China )
Abstract：As flip chip solder joints trend to high density and tiny pitch, deformation, warping and scratching may occur in flip chip bumping interface, causing solder joint defects because of solder joint fatigue accumulation and stress concentration. It hinders the development of flip chip technology. In this paper, a defect inspection method for flip chip open solder joints was proposed. The simulation and experiment results revealed that open solder joints induced the modal shape change and resonance frequency decrease of flip chip samples. This finding demonstrates that open solder joints defect of flip chip can be detected through modal features, such as modal shape and resonance frequency, which shows a potential way for solder joint defect inspection.
Key words：flip chip；modal analysis；defect inspection
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收稿日期：2016－06－27
作者简介：刘俊超（1985－），男，四川成都人，博士，工程师，主要研究方向为微纳制造。
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