某电子设备散热设计优化

 袁亚辉,万里

(广州海格通信集团股份有限公司,广东 广州 510663)
摘要:电子器件的发热导致其可靠性降低,甚至会造成设备的系统失效。某箱式电子设备,由元器件的最高结温计算出其许用结温。在环境温度为+55℃时,对该电子设备初始仿真,结果显示部分元器件的温度高于其许用结温。通过在发热器件表面增加散热器和在盖板的相应位置设计凸台使之与器件紧密接触的方式对结构进行优化设计。再次对该电子设备进行热仿真计算,结果显示器件温度大幅下降,温升控制在+30℃以内,以较低的成本实现了热设计的目标。
关键词:电子设备;元器件;散热设计
中图分类号:TN61/65 文献标志码:A doi:10.3969/j.issn.1006-0316.2017.12.012
文章编号:1006-0316 (2017) 12-0045-03
Optimization of Thermal Design of an Electronic Equipment
YUAN Yahui,WAN Li
( Guangzhou Haige Communications Group Incorporated Company, Guangzhou 510663, China )
Abstract:The heat produced by electronic components results in lower reliability of electronic equipment, what even causes the equipment out of work. The case is a box electronic equipment. The allowable junction temperatures of the components were calculated by their max junction temperatures. The initial thermal simulation about the electronic equipment under the environment temperature +55℃. The simulation result showed that the temperatures of some components were higher than their allowable junction temperatures. Then the optimization design of the structure was operated with adding heat sinks on the surface of the thermal components and designing bulges which were got closed to with the components in corresponding positions of the cap. The second thermal simulation was operated about the electronic equipment. The results showed that the temperatures of the components decreased too much, and the temperatures rise were controlled bellow +30℃. It illustrates that the goal of thermal design can be achieved at low cost.
Key words:electronic equipment;component;thermal design;optimization
———————————————
收稿日期:2017-04-24
作者简介:袁亚辉(1983-),男,河南舞阳人,硕士,工程师,主要研究方向为电子通信设备结构设计、热仿真设计、冲击跌落仿真;万里(1989-),男,湖南衡阳人,硕士,工程师,主要研究方向为电子通信设备结构设计、热仿真设计。
 

 

设为首页  |  加入收藏    |   免责条款
《机械》杂志版权所有     Copyright©2008-2012 Jixiezazhi.com All Rights Reserved 

  电话:028-85925070    传真:028-85925073    E-mail:jixie@vip.163.com

地址:四川省成都锦江工业开发区墨香路48号   邮编:610063

蜀ICP备08103512号

Powered by PageAdmin CMS